GOLOHO
Silicone Grease are adhesive thermal compounds like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device or PCB system assembly to the heat sink or chassis, thereby increasing the overall efficiency of the device. PCB system assemblies are continually designed to deliver higher performance. Especially in the area of consumer devices, there is also a continuing trend towards smaller, more compact designs. In combination, these factors typically mean that more heat is generated in the device.
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