Light Emitting Diode(LED)

What is LED?

LED is short for Lighting Emitting Diode which is semi-conductor lighting emitting unit. Solid semi-conductor chip as the luminescent material, it will emit light of red, yellow, blue and green directly through photon emission by the carrier in semi-conductor compound giving off exceed energy. LED could emit random color light by adding phosphor in this principle of tricolor on the basis. LED are used as light resource to make LED lights.
LED-Industry-Solutions-2

LED Industry

LED lights give us more colorful nights. In addition, it has many advantages such as power saving, long life, high light, wide viewing and long visible distance.

GOLOHO—LED industry solutions

High/low Refractive Index LED encapsulant
Adhesive sealant
Thermal conductive silicone
Thermal conductive silicone grease
Thermal conductive encapsulant

Encapsulant

Property	4930C	4940C	4950C	4965C
A, Viscosity(mPa·s)	3000	3500	4200	5500±500
B, Viscosity(mPa·s)	4000	4000	4000	5500±500
Mix ratio	1:2	1:3	1:4	1:1
Mix viscosity(mPa·s)	3800	3900	4000	5500±1000
Working time	＞8h	＞8h	＞8h	≥6h
Cure conditions	80℃1h 150℃3h	80℃1h 150℃3h	80℃1h 150℃3h	100℃1h 150℃3h
Diopter	1.534	1.534	1.534	1.41
durometer	35D	45D	55D	65A±5
Light transmittance	98%	98%	98%	95%

sealant

Property	Unit	2391	2491	2496	2492	7191
Color		W/B/G	W/B/G	W/B/G	W/B/G colorless	B
Appearance		Paste	Paste	Paste	Paste	Flowable
Specific gravity	g/cm3	1.46	1.40	1.38	0.99	1.4
Tack-free time	min	5~10	5~10	9~20	2~5	15~30
Hardness	JIS A	42	44	45	30	30
Tensile strength	Mpa	2.0	2.0	2.3	21.5	1.2
Elongation at break	%	≥250	≥200	≥300	≥400	≥200
Shear strength	Mpa	1.8	1.8	2.2	1.0	1.5
Volume resistance	Ω·cm	≥0.5E+15	≥1.0E+15	≥0.5E+15	≥1.0E+15	≥0.5E+15
Notes	Cure condition: 25℃, RH75%; 7191 is a two-component adhesive, the entire cure time is 2h

Thermal Conductive Encapsulant

Property	Unit	313	4302	4302-4	7002C
Type		Si condensation	Si addition	Si addition	Si condensation
Color		B/W/G	B/W/G	B/W/G	colorless
Mix ratio	By weight	6:1	1:1	1:1	10:1
Viscosity	mPa·s	3000±500	4000±500	4000±500	1500±500
Specific gravity	g/cm3	1.6±0.1	1.6±0.1	1.8±0.1	1.0±0.1
Working time	min	30~40	30~60	30~60	25~35
Curing time	h	3	4	4	1
Hardness	JIS A	50±5	50±5	50±5	20±5
Thermal conductivity	W/m·k	0.8	0.6~0.8	1.0	0.2
Volume resistance	Ω·cm	＞1E+15	＞1E+14	＞1E+14	＞0.5*1015
Flame class	UL	HB	V-0	V-0	HB

Thermal Conductive Silicone

Property	unit	2741	2742	2743	4326
Color		White	White	White	Grey
Appearance		Paste	Paste	Flowable	Half-paste
Specific gravity	g/cm3	2.5	2.7	2.9	2.7
Tack-free time	min	2~6	2~5	5~20
Entirety cure time	h	24（2mm)	24（2mm)	24（2mm)	150℃8min
Hardness	JIS A	65	70	93	45
Thermal conductivity	W/m·k	1.2	2.0	3.0	1.8
Volume resistance	Ω·cm	1.0*1015	1.0*1015	7.4*1014	0.5*1015
Shear strength	Mpa	＞2.0	＞2.0	＞1.5	4.5~4.7
Flame resistance	UL94	V-0	V-0	V-0	V-0
Notes	4326, one-part conditional thermal conductive adhesive, rapid cure

Company Profile

GOLOHO POLYMER was established in 1995 which is the leading conglomerate in China specialized in industrial adhesive R&D and production. Our main products are organic silicone adhesive, silicone resin, epoxy resin and PU.
It has the leading technology platform and production process after more than twenty years' of development and technology accumulation. We execute critical quality management system.
There are factories and technical center in Shenzhen and Changzhou, Jiangsu. It has been accepted by serious premium brand customers.
GOLOHO POLYMER provides global customers the overall solutions with safe, reliable, innovative high-tech products and high-end service.